PT Journal
AU Komlossy, M
   Dzimko, M
   Takeichi, Y
   Uemura, M
TI Frictional Behaviour of Thin Tin Films with a Copper Interlayer
SO Communications - Scientific Letters of the University of Zilina
PY 2005
BP 36
EP 40
VL 7
IS 1
DI 10.26552/com.C.2005.1.36-40
WP https://komunikacie.uniza.sk/artkey/csl-200501-0007.php
DE no keywords
SN 13354205
AB Generally, the purpose of the study is to know the effect of temperature during tin-films deposition on frictional behaviour and lifetime of a tin layer with copper interlayer. In a recent study an experimental approach was performed to investigate the effect of a copper interlayer thickness on frictional behaviour of thin films. In this experiment, copper of 2 m thickness was deposited between the steel substrate and tin films of 1 m and 2 m thicknesses in vacuum environment without and with the heating of the substrate up to 300 °C. The friction tests were performed to determine the friction coefficient and lifetime of lubrication capability.
ER