RT Journal Article
SR Electronic
A1 Frivaldsky, Michal
A1 Spanik, Pavol
A1 Morgos, Jan
A1 Glapa, Norbert
T1 Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
JF Communications - Scientific Letters of the University of Zilina
YR 2018
VO 20
IS 1
SP 78
OP 81
DO 10.26552/com.C.2018.1.78-81
UL https://komunikacie.uniza.sk/artkey/csl-201801-0013.php
AB Very thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases - it significantly extends simulation computational time. In this paper we propose substitution of the PCB in axial and radial direction with the composite structure with equivalent physical parameters of multilayer PCB.