Communications - Scientific Letters of the University of Zilina 2012, 14(11):53-57 | DOI: 10.26552/com.C.2012.4A.53-57
Performance Parameters of a Closed Loop Thermosyphon
- 1 Department of Power Engineering, Faculty of Mechanical Engineering, University of Zilina, Slovakia
Devices composed of output electronic components produce waste heat that has to be dissipated to the environment. Heat removal by means of forced convection air cooling is quite often insufficient and new alternatives for cooling of output electronic components are being looked for. One option is the use of a closed loop thermosyphon. Theclosed loop thermosyphonis a simple and reliabledevice providing heat transfer. The paper deals with the cooling of an output electronic component by means of this device. It describes a design and construction of the device to provide heat removal from the electronic component, measurement of dependences of performance parameters on waste performance of the electronic component and their verification by means of a mathematic calculation based on physical phenomena of boiling, condensation and heat transfer.
Keywords: closed loop thermosyphon, heat transfer, Fluorinert FC-72, mathematical model
Published: December 31, 2012 Show citation
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References
- HARTENSTINE, J., BONNER III, R., MONTGOMERY, J., SEMENIC, T.: Loop ThermosyphonDesign for Cooling of Large Area, High Heat Flux Sources. Proc. of IPACK 2007, Vancouver, CANADA
Go to original source... - RUPPERSBERG, J. C., DOBSON, R. T.:Flow and Heat Transfer in Closed Loop Thermosyphon - Part II: Experimental Simulation. J. of Energy in Southern Africa, vol. 18, No. 3, 2007
Go to original source... - ANDREWS. J., AKBARZADEH. A., SAUCIUC. I.: Heat Pipe Technology: Theory, Applications and Prospects. Melbourne: PERGAMON, 1996. ISBN 0 08 042842 8
- 3M Fluorinert™ Electronic Liquid FC-72 product information, Accessible at: http://multimedia.3m.com/mws/mediawebserver?mwsId=66666UF6EVsSyXTtnxTE5XF6EVtQEVs6EVs6EVs6E666666--&fn=prodinfo_FC72.pdf
- REAY, D., KEW, P.: Heat Pipes-Theory, Design and Applications. Burlington: Elsevier, 2006.ISBN-13: 978-0-7506-6754-8
- SAZIMA, M.: Sdileni tepla[Heat Transfer], Prague: SNTL, 1993. ISBN 80-03-00675-9.
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