Communications - Scientific Letters of the University of Zilina 2005, 7(1):36-40 | DOI: 10.26552/com.C.2005.1.36-40

Frictional Behaviour of Thin Tin Films with a Copper Interlayer

Martin Komlossy1, Marian Dzimko1, Yoshinori Takeichi2, Masao Uemura2
1 Faculty of Mechanical Engineering, University of Zilina, Slovakia
2 Toyohashi University of Technology, Department of Mechanical Engineering, Tempaku-cho, Toyohashi-shi, Aichi, Japan

Generally, the purpose of the study is to know the effect of temperature during tin-films deposition on frictional behaviour and lifetime of a tin layer with copper interlayer. In a recent study an experimental approach was performed to investigate the effect of a copper interlayer thickness on frictional behaviour of thin films. In this experiment, copper of 2 m thickness was deposited between the steel substrate and tin films of 1 m and 2 m thicknesses in vacuum environment without and with the heating of the substrate up to 300 °C. The friction tests were performed to determine the friction coefficient and lifetime of lubrication capability.

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Published: March 31, 2005  Show citation

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Komlossy, M., Dzimko, M., Takeichi, Y., & Uemura, M. (2005). Frictional Behaviour of Thin Tin Films with a Copper Interlayer. Communications - Scientific Letters of the University of Zilina, 7(1), 36-40. doi: 10.26552/com.C.2005.1.36-40
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    References

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