Communications - Scientific Letters of the University of Zilina 2018, 20(1):92-96 | DOI: 10.26552/com.C.2018.1.92-96

High Current Applications Issues in Designs of High Current Applications

Patrik Varecha1, Vladimir Vavrus1, Bretislav Zuczek2
1 Department of Power Electrical Systems, Faculty of Electrical Engineering, University of Zilina, Slovakia
2 NXP Semiconductors, Roznov pod Radhostem, Czech Republic

This paper deals with design high current printed circuit boards (PCB), with the issues of implementation the power layer into standard PCB and influence of parasitic parameters of conductive traces of PCB. The parasitic parameters of conductive traces play a significant role in design of high current PCB, and therefore must be minimized. The technology of manufacturing PCB for high current designs as a compact device is mentioned in the paper. The quality of MOSFET switching power in high current design was compared in two ways of proposed leading power lines in order to demonstrate the influence of parasitic inductances of conductive traces.

Keywords: automotive; high current; printed circuit board

Published: March 31, 2018  Show citation

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Varecha, P., Vavrus, V., & Zuczek, B. (2018). High Current Applications Issues in Designs of High Current Applications. Communications - Scientific Letters of the University of Zilina, 20(1), 92-96. doi: 10.26552/com.C.2018.1.92-96
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