Communications - Scientific Letters of the University of Zilina 2023, 25(2):C36-C47 | DOI: 10.26552/com.C.2023.032

Increase of the Automotive Power Transistor Modules Manufacture Reliability Using Ai Detecting System for Soldering Splashes

Dušan Koniar ORCID...1, Peter Klčo ORCID...1, Libor Hargaš ORCID...1, Marek Chnápko2, Katarína Pocisková Dimová2, Vladimír Kindl ORCID...3, *
1 Department of Mechatronics and Electronics, Faculty of Electrical Engineering and Information Technologies, University of Zilina, Zilina, Slovakia
2 Semikron, s.r.o., Vrbove, Slovakia
3 Department of Power Electronics and Machines, Faculty of Electrical Engineering, University of West Bohemia, Pilsen, Czech Republic

This study discusses the automated visual inspection of electronic boards used in the mass production of power electronics equipment. Soldering splashes, produced during the necessary manufacturing stages, can affect the hybrid power semiconductor modules' quality, specifications and lifespan. Splashes from soldering may appear in some electronic boards areas when they may cause decreasing of quality of these boards and need to be removed. Image analysis algorithms are used to search for such areas. The automated inspection is based on neural network YOLO. The images of electronic boards, acquired by authors in SEMIKRON Slovakia company, were used as training, testing and validation dataset for the YOLO network. The custom recording system was designed to acquire those images. The implementation of this method may increase the object search success and then thereby increase the overall quality of module production.

Keywords: transistor, module, solder, splash
Grants and funding:

The results presented in this paper were supported by grant No. APVV 20-0500 - Research of methodologies to increase the quality and lifetime of hybrid power semiconductor modules. This research has also been supported by the Ministry of Education, Youth and Sports of the Czech Republic under the project OP VVV Electrical Engineering Technologies with High-Level of Embedded Intelligence CZ.02.1.01/0.0/0.0/18_069/0009855. Authors want to thank all SEMIKRON Slovakia company staff for cooperation.

Conflicts of interest:

The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Received: December 5, 2022; Accepted: January 25, 2023; Prepublished online: March 1, 2023; Published: April 6, 2023  Show citation

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Koniar, D., Klčo, P., Hargaš, L., Chnápko, M., Pocisková Dimová, K., & Kindl, V. (2023). Increase of the Automotive Power Transistor Modules Manufacture Reliability Using Ai Detecting System for Soldering Splashes. Communications - Scientific Letters of the University of Zilina, 25(2), C36-47. doi: 10.26552/com.C.2023.032
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